August 2019

The latest TIA Standard for Telecommunications Bonding and Grounding (TIA-607-D) was released in July 2019. After a quick review there appears to be only a few revisions to the standard as it relates to bonding components and design requirements for telecommunications equipment ground bonding. Following are some areas where minor revisions were made: 6.3.5 Sizing the Secondary Bonding Conductor (SBC...

Data Center Frontier shared a paper by Sunbird Software - 7 Best Practices for Simplifying Data Center Cable Management. The paper is presenting the benefits of utilizing a DCIM system in a data center, and while the paper is a quick and easy read, some of the pro tips caught my attention especially as it relates to power distribution cables...